Printed circuit board assembly provider right now? Best Technology, establish on June 28, 2006, is a Hong Kong registered company whom focused on one-stop solution provider of FPC, Rigid-flex, MCPCB, FR4 PCB, Ceramic PCB, Special PCB such as Heavy Copper (up to 20 OZ), extra thin PCB (0.10, 0.15mm), and PCB assembly service. Discover additional info at best pcb assembly service. Quality Policy: PCB Quality is the core of products. All of engineer & vital department guys has more than five years expenrience in PCB industry, we follow up the default PCB standard, as well as with clients’ special request.
A single sided flexible printed circuit (1 layer flex circuit) is a flex circuit with one layer of copper trace on one substrate, and with one layer Polyimide coverlay laminated to copper trace so that only one side copper will be exposed, so that it only allowing access to copper trace from one side, comparing to dual access flex circuit which allows access from both top and bottom side of flex circuit. As there’s only one layer of copper trace, so it also named as 1 layer flexible printed circuit, or 1 layer flexible circuit, or even 1 layer FPC, or 1L FPC. The multi layer flex circuit refer to a flex circuit with more than 2 layer circuit layers. Three or more flexible conductive layers with flexible insulating layers between each one, which are interconnected by way of metallized hole through the vias/holes and plating to form a conductive path between the different layers, and external are polyimide insulating layers.
In order to provide one-stop-services to customers, we can also provide FPC and Rigid-flex PCB Assembly service (also named SMT: Surface Mounting Technology). We can purchase all components from abroad or domestic market, and provide full products to you with short lead time. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Find even more information at https://www.bstpcb.com/.
Sometimes people will use abbreviation “MCPCB”, instead of the full name as Metal Core PCB, or Metal Core Printed Circuit Board. And also used different word refers the core/base, so you will also see different name of Metal Core PCB, such as Metal PCB, Metal Base PCB, Metal Backed PCB, Metal Clad PCB and Metal Core Board and so on. MCPCBs are used instead of traditional FR4 or CEM3 PCBs because of the ability to efficiently dissipate heat away from the components. This is achieved by using a Thermally Conductive Dielectric Layer.